Services - Module Level (PCB)

Spark & Roberts has a wealth of experience in the design and optimization of wireless products.

In regards to the product level activities, the following services can be offered (please feel free to contact Spark & Roberts about your requirements!):

• wireless performance optimization:
  • antenna selection, placement, tuning, optimization
  • PCB RF tuning
  • system architecture level, baseband parameters (e.g. Matlab, measurements)
• (printed) antenna design and optimization (some samples here)
• (discrete) RF design, e.g. Bluetooth RF PA optimized for linearity and power consumption
• RF module PCB (multi-layer, BGA, multi-chip-module, flip-chip, micro-assemblies...) design and development (samples HERE)
  • FR4, BT
  • Ceramic (Al2O3, AlN)
  • Prototype services (PCB manufacturing, PCB assembly, test)
  • RF design using PUFF, FDTD 3D structure simulator
• radiated emissions testing, regulatory pre-scans (>1GHz), EMC, FCC/ETSI
• identification of emission source location and optimization (e.g. minimizing radiation from clock/bus sources, RF harmonics optimization, etc.)
• failure analysis, production yield optimization

Spark & Roberts has full in-house capabilities and tools to support the above activities:

• spectrum analyzer for e.g. emissions testing
• reference antennas for e.g. antenna gain measurement, emissions testing
• network analyzer for e.g. antenna optimization and PCB RF tuning
• near-field RF probes to locate emission sources, to measure antenna current distribution and to identify ground loops
• digital oscilloscope and logic analyzer
• antenna structure simulator (FDTD)
• RF simulator to investigate PCB RF characteristics
• PCB desig tools (schematic, layout, gerber, signal integrity)
• system level simulation software

Through third parties, Spark & Roberts offers the following additional services:

• radiation pattern measurements
• certification/compliance testing
• production test development